We are pleased to offer procurement for The Boeing Company part number 21-59190-7 here on NSN Portal, a Microcircuit Memory product that is listed with the NSN 5962-01-125-2362 for ease of identification. You have reached our Request for Quote (RFQ) form for this listing, where you are encouraged to submit details on your requirements to receive tailored purchasing options from our staff. As you will see, we ask that you offer key information on your pricing target, desired quantity, and more, as this will ensure that the representative who responds to your request is able to provide the most fitting solutions for your needs.
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Whether you procure part number 21-59190-7 or other NSN products from our website, you can rest assured that we uphold full traceability for all items. For example, this particular listing traces back to The Boeing Company through the CAGE Code 81205, as well as falls under FSC 5962 Microcircuits Electronic based on having the NSN 5962-01-125-2362. Furthermore, every purchase will be delivered with any applicable qualifying certifications or manufacturer trace documentation as per our NO CHINA SOURCING pledge. If you are ready to experience why professionals rely on us for their needs, request a quote for part number 21-59190-7 today and take advantage of our industry-leading services.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-125-2362 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 011252362 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| ROM/PROM | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.285 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.600 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.175 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 633.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/100.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
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