We are pleased to offer procurement for Intersil Corporation part number D2147-3 here on NSN Portal, a Microcircuit Memory product that is listed with the NSN 5962-01-155-1502 for ease of identification. You have reached our Request for Quote (RFQ) form for this listing, where you are encouraged to submit details on your requirements to receive tailored purchasing options from our staff. As you will see, we ask that you offer key information on your pricing target, desired quantity, and more, as this will ensure that the representative who responds to your request is able to provide the most fitting solutions for your needs.
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Whether you procure part number D2147-3 or other NSN products from our website, you can rest assured that we uphold full traceability for all items. For example, this particular listing traces back to Intersil Corporation through the CAGE Code 32293, as well as falls under FSC 5962 Microcircuits Electronic based on having the NSN 5962-01-155-1502. Furthermore, every purchase will be delivered with any applicable qualifying certifications or manufacturer trace documentation as per our NO CHINA SOURCING pledge. If you are ready to experience why professionals rely on us for their needs, request a quote for part number D2147-3 today and take advantage of our industry-leading services.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-155-1502 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 011551502 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
584R265H03 | 2 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.360 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.360 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 968.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND STATIC OPERATION AND W/ENABLE AND MONOLITHIC |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 15 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | RAM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 97942-584R265 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAW |
TTQY | TERMINAL TYPE AND QUANTITY | 18 FLAT LEADS |
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